Housing adapted to releasably receive a device bay electronic component



FIG. 1 is a front elevation view of the housing showing our new invention;

FIG. 2 is a left elevation view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a back elevation thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view of the preferred embodiment thereof showing the device closed; and,

FIG. 8 is a perspective view of the preferred embodiment thereof showing the device open.

The broken-line disclosure in the drawings is for illustrative purposes only and forms no part of the claimed design. 

We claim the ornamental design for a housing, adapted to releasably receive a device bay electronic component as shown and described. 